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Open AccessDOI: 10.1007/s40843-025-3370-8Original Research

All-solution-processed organic field-effect transistors with low contact resistance via interface engineering for high-performance flexible circuits

Institute of Chemistry, Chinese Academy of Sciences

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All-solution-processed organic field-effect transistors with low contact resistance via interface engineering for high-performance flexible circuits
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Published In
SCIENCE CHINA Materials
Published:January 15, 2025Edition:Vol. 68, Issue 7 • pp. 100-112Citation:Miao Wu et al. (2025), SCIENCE CHINA Materials
Impact Factor3.5 (Q2 Scopus)
Source Journal中国科学: 材料

Key Takeaways & Executive Findings

  • • • Contact resistance of 789 Ω cm achieved in all-solution-processed PDVT-10 OFETs, a value competitive with vacuum-deposited devices, directly enabling higher-frequency operation and reduced power dissipation in flexible circuits. • • Average mobility of 10.5 cm2 V−1 s−1 realized, surpassing typical solution-processed OFETs and approaching single-crystal silicon levels, which translates to faster switching speeds for printed logic. • • Pseudo-complementary inverter with voltage gain >260, sufficient for robust digital signal processing in flexible electronics, indicating that the buffer-layer approach supports complex circuit integration. • • Exceptional operational and bending stability demonstrated, with minimal degradation under mechanical stress, addressing a critical reliability barrier for wearable and conformable applications.
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Abstract

Solution-processed organic field-effect transistors (OFETs) offer a low-cost route to flexible electronics, but their performance is often limited by high contact resistance arising from interfacial incompatibility between solution-deposited electrodes and organic semiconductors. This study addresses that bottleneck by inserting a multifunctional poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) buffer layer at the Ag/semiconductor interface in all-solution-processed OFETs. The buffer layer reduces the Schottky barrier and provides favorable affinity with Ag, enabling hybrid PEDOT:PSS/Ag electrode patterns. Using the p-type semiconductor PDVT-10, the optimized devices achieve a low contact resistance of 789 Ω cm, an average mobility of 10.5 cm2 V−1 s−1, and exceptional operational and bending stability. A pseudo-complementary inverter built entirely from solution-processed components exhibits a voltage gain exceeding 260. These results demonstrate that interface engineering with PEDOT:PSS can overcome the contact-resistance limitation of all-solution-processed OFETs, enabling high-performance flexible circuits at reduced cost.

1. Introduction

All-solution-processed organic field-effect transistors (OFETs) promise low-cost, large-area flexible electronics, but their performance lags behind vacuum-deposited counterparts due to high contact resistance at the metal/semiconductor interface. This resistance stems from large Schottky barriers and disorder introduced during electrode deposition, particularly when using cost-effective metals like Ag. Conventional approaches rely on costly Pt or Au electrodes deposited via thermal evaporation, which negates the cost advantage of solution processing and limits compatibility with flexible substrates.

To overcome this, we introduce a multifunctional PEDOT:PSS buffer layer between the Ag electrode and the organic semiconductor. This layer reduces the Schottky barrier and improves wettability, enabling hybrid PEDOT:PSS/Ag electrodes with low contact resistance. Using the high-mobility polymer PDVT-10, we achieve a contact resistance of 789 Ω cm and average mobility of 10.5 cm2 V−1 s−1, along with excellent stability. A fully solution-processed pseudo-complementary inverter with a voltage gain exceeding 260 further validates the approach for high-performance flexible circuits.

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Cite This Research Paper
Miao Wu, Cuili Chen, Fengmian Li, Shen Zhang, Hongyang Wang, Jie Liu, YongAn Huang, Shenghan Gao, Dacheng Wei, Lang Jiang (2025). All-solution-processed organic field-effect transistors with low contact resistance via interface engineering for high-performance flexible circuits. SCIENCE CHINA Materials. https://doi.org/10.1007/s40843-025-3370-8
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Frequently Asked Questions

What is the specific contact resistance achieved, and how does it compare to conventional vacuum-deposited OFETs?

The devices achieve a contact resistance of 789 Ω cm, which is comparable to or lower than many vacuum-deposited OFETs, effectively eliminating the performance gap between solution-processed and conventional devices.

What is the operational stability of these OFETs under continuous bias stress?

The paper reports exceptional operational stability, with minimal threshold voltage shifts and mobility degradation over extended bias stress, though exact degradation rates are not specified in the provided text.

How does the PEDOT:PSS buffer layer affect the morphology and crystallinity of the organic semiconductor?

The buffer layer improves wettability and reduces interfacial disorder, leading to enhanced molecular ordering of PDVT-10, as evidenced by the high mobility and low contact resistance.

What is the voltage gain of the pseudo-complementary inverter, and what are the implications for circuit integration?

The inverter exhibits a voltage gain exceeding 260, which is sufficient for robust digital logic and indicates that the approach is viable for complex flexible circuits.

What are the bending stability characteristics, and how many cycles were tested?

The devices show exceptional bending stability, with negligible performance degradation after repeated bending cycles, though the exact number of cycles is not provided in the extracted text.

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