Key Takeaways & Executive Findings
- •• • The LEGO-like modular assembly enables multilayer 3D stretchable electronics with enhanced integration density, overcoming the limitations of single-layer architectures that restrict functional complexity. • • Liquid metal circuits combined with self-healing polyurethane substrates allow devices to withstand diverse deformation conditions and autonomously heal after mechanical damage, extending service life. • • The fabricated devices can undergo multiple recycling and reuse cycles, addressing environmental concerns associated with electronic waste. • • The modular design simplifies fabrication processes, reducing cost and complexity compared to conventional 3D integration techniques.
Abstract
Stretchable electronics are pivotal for bio-integrated devices, soft robotics, and wearables, yet their development is constrained by single-layer architectures that limit integration density and by mechanical mismatch between rigid components and soft substrates, which curtails service life. Here, we introduce a LEGO-like modular assembly strategy to construct multilayer three-dimensional (3D) stretchable electronics. Electronic components (ECs) and self-healing polyurethane (SPU) substrates patterned with liquid metal (LM) circuits serve as the modular blocks. This design simplifies fabrication and markedly enhances 3D integration density. The combination of LM circuits and self-healing elastic substrates enables devices to withstand diverse deformations and to autonomously heal after mechanical damage. Notably, the devices can undergo multiple recycling and reuse cycles without significant performance loss. This methodology offers a new paradigm for advanced flexible electronics, addressing critical bottlenecks in integration density, mechanical robustness, and sustainability.
1. Introduction
Conventional stretchable electronics predominantly rely on single-layer circuit architectures, which fundamentally cap integration density and functional complexity. While multilayer 3D integration and micro-nano techniques have been proposed, their practical adoption is hindered by intricate assembly processes, elevated costs, and mechanical incompatibility between rigid electronic components and soft elastic substrates. These issues precipitate premature device failure and contribute to escalating electronic waste, underscoring an urgent need for a fabrication strategy that reconciles high-density integration with mechanical robustness and sustainability.
This work introduces a LEGO-like modular assembly strategy that treats electronic components and self-healing polyurethane substrates patterned with liquid metal circuits as interchangeable building blocks. This approach directly addresses the bottleneck of complex 3D assembly by enabling straightforward, layer-by-layer construction. The inherent self-healing properties of both the liquid metal circuits and the polyurethane substrate mitigate mechanical mismatch and extend device longevity, while the modular design facilitates recycling and reuse, offering a sustainable pathway for next-generation stretchable electronics.
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WANG Qingyu, YANG Xiaoying, HU Zijuan, LI Yajun, ZHANG Xuanming, LIU Bingqian, YANG Pengkun, HUANG Lu, WU Yingpeng (2026). LEGO-like Three-Dimensional Integrated Stretchable Electronics. SCIENCE CHINA Materials. https://doi.org/10.1007/s40843-025-3615-1
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Frequently Asked Questions
What specific mechanical properties (e.g., tensile strength, elongation at break) does the self-healing polyurethane substrate exhibit, and how do they compare to conventional elastomers used in stretchable electronics?
The paper does not provide quantitative mechanical data for the SPU substrate. However, it is designed to be highly elastic and self-healing, which is critical for withstanding repeated deformations. For comparison, typical elastomers like Ecoflex or PDMS have elongations at break of 400-900%, but lack self-healing. The SPU's self-healing capability is a key advantage, though specific values are not disclosed.
How does the LEGO-like assembly achieve electrical interconnection between layers, and what is the contact resistance at the interfaces?
The paper does not detail the interconnection mechanism or provide contact resistance values. It likely relies on the liquid metal circuits being patterned on each SPU layer and aligned during assembly. The self-healing nature of the SPU and LM may facilitate conformal contact. However, quantitative data on contact resistance is absent, which is a limitation for high-frequency applications.
What is the maximum number of layers that can be stacked without compromising mechanical integrity or electrical performance?
The paper does not specify a maximum layer count. It demonstrates the concept with a certain number of layers, but the scalability to many layers is uncertain. The mechanical robustness and electrical reliability under repeated stacking and deformation would need to be evaluated for higher layer counts.
How many recycling cycles can the devices withstand, and what is the retention of electrical conductivity after each cycle?
The paper states that devices can undergo 'multiple recycling and reuse cycles,' but does not provide exact numbers or conductivity retention percentages. This is a critical parameter for sustainability claims. Without quantitative data, the practical recyclability remains unverified.
What is the maximum strain that the integrated devices can endure while maintaining electrical functionality, and how does this compare to state-of-the-art stretchable electronics?
The paper does not report specific strain limits. It mentions that devices can withstand 'diverse deformation conditions,' but without quantitative strain values, it is difficult to benchmark against other technologies. Typically, stretchable electronics aim for strains >100%, but this work lacks such data.
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