• • The LEGO-like modular assembly enables multilayer 3D stretchable electronics with enhanced integration density, overcoming the limitations of single-layer architectures that restrict functional complexity.
• • Liquid metal circuits combined with self-healing polyurethane substrates allow devices to withstand diverse deformation conditions and autonomously heal after mechanical damage, extending service life.
• • The fabricated devices can undergo multiple recycling and reuse cycles, addressing environmental concerns associated with electronic waste.
• • The modular design simplifies fabrication processes, reducing cost and complexity compared to conventional 3D integration techniques.