LEGO-like Three-Dimensional Integrated Stretchable Electronics
Stretchable electronics are pivotal for bio-integrated devices, soft robotics, and wearables, yet their development is constrained by single-layer architectures that limit integration density and by mechanical mismatch between rigid components and soft substrates, which curtails service life. Here, we introduce a LEGO-like modular assembly strategy to construct multilayer three-dimensional (3D) stretchable electronics. Electronic components (ECs) and self-healing polyurethane (SPU) substrates patterned with liquid metal (LM) circuits serve as the modular blocks. This design simplifies fabrication and markedly enhances 3D integration density. The combination of LM circuits and self-healing elastic substrates enables devices to withstand diverse deformations and to autonomously heal after mechanical damage. Notably, the devices can undergo multiple recycling and reuse cycles without significant performance loss. This methodology offers a new paradigm for advanced flexible electronics, addressing critical bottlenecks in integration density, mechanical robustness, and sustainability.