SCIENCE CHINA Materials•2026•DOI: 10.1007/s40843-025-3615-1
Stretchable electronics are pivotal for bio-integrated devices, soft robotics, and wearables, yet their development is constrained by single-layer architectures that limit integration density and by mechanical mismatch between rigid components and soft substrates, which curtails service life. Here, we introduce a LEGO-like modular assembly strategy to construct multilayer three-dimensional (3D) stretchable electronics. Electronic components (ECs) and self-healing polyurethane (SPU) substrates patterned with liquid metal (LM) circuits serve as the modular blocks. This design simplifies fabrication and markedly enhances 3D integration density. The combination of LM circuits and self-healing elastic substrates enables devices to withstand diverse deformations and to autonomously heal after mechanical damage. Notably, the devices can undergo multiple recycling and reuse cycles without significant performance loss. This methodology offers a new paradigm for advanced flexible electronics, addressing critical bottlenecks in integration density, mechanical robustness, and sustainability.
SCIENCE CHINA Materials•2026•DOI: 10.1007/s40843-025-3725-1
Conductive hydrogel-based stretchable electronics have been extensively investigated, with strain sensors being the most prominently studied. While mechanical properties significantly affect device performance, the systematic correlation between specific mechanical parameters and sensing performance remains rarely explored. This work compares the influences of Young’s modulus and mechanical hysteresis on sensing performance between highly entangled PAM-Li and double-network PAM-Li-Agar-3 strain sensors. Owing to the brittle agar network, which imparts a higher Young’s modulus and pronounced mechanical hysteresis to the double-network PAM-Li-Agar-3 hydrogel, the corresponding sensor requires a greater driving force for deformation and yields signals with poor reproducibility. In contrast, the PAM-Li hydrogel, characterized by highly entangled polymer chains, exhibits a lower Young’s modulus and negligible mechanical hysteresis. Consequently, signals from the PAM-Li strain sensor demonstrate enhanced sensitivity and stability. Therefore, this work demonstrates that a low Young’s modulus and minimal mechanical hysteresis are critical factors for achieving superior sensing performance in strain sensors, as systematically validated through comparative analyses across diverse application scenarios.
SCIENCE CHINA Materials•2026•DOI: 10.1007/s40843-025-3983-4
Refrigeration is essential for modern society, supporting applications from household appliances and industrial manufacturing to microelectronics and biopharmaceutical cold chains. Conventional refrigeration technologies are constrained by environmental impact and low energy efficiency, emphasizing the importance of developing sustainable alternatives. Solid-state caloric refrigeration, particularly electrocaloric (EC) devices, offers a promising route owing to their high cooling efficiency, rapid electric-field-driven response, and potential for miniaturization. Significant progress has been achieved in various EC device configurations. However, EC devices still face challenges in achieving large temperature spans, high cooling power, and effective integration for specific applications. This review systematically summarizes these developments, focusing on device design and performance enhancement. It elucidates the fundamental and shared design strategies, classifies EC devices into fluid-based heat-transfer type, solid-based heat-transfer type, and thermal-resistance-modulated heat-switch architectures, and analyzes representative device structures, performance metrics, and application scenarios. Finally, energy-recovery strategies and future optimization directions toward more efficient EC systems are discussed. This work provides a comprehensive reference for the design innovation and practical implementation of EC-based solid-state refrigeration technologies.