SinoGreenTech Academic Portal
JJ
Verified CAS / Academic Author2 Decoded Studies

Prof. Jinkun Jiang

Ocean University of China

Co-Affiliations:Fuzhou University

Research Publications & English Decoded Briefs

Showing 2 publications
SCIENCE CHINA Materials2026DOI: 10.1007/s40843-025-3761-7

Ruthenium-Based Electrocatalysts for Electrochemical Water Splitting: A Review of Fundamentals, Synthesis, and Enhancement Strategies

Ruthenium-based materials, including metallic Ru and RuO2, are promising electrocatalysts for electrochemical water splitting (EWS) due to their high activity for both hydrogen evolution reaction (HER) and oxygen evolution reaction (OER). However, their practical application is hindered by the relatively strong adsorption of reaction intermediates on Ru surfaces and the oxidative dissolution of RuO2 under operating conditions. This review provides a comprehensive overview of recent progress and challenges in Ru-based electrocatalysts for EWS. We first summarize the fundamentals of EWS, including reaction mechanisms and activity descriptors. Then, we detail typical synthesis methods such as hydrothermal/solvothermal syntheses, organic ligand-assisted syntheses, pyrolysis, acid etching, cation exchange, and molten salt-assisted syntheses. Subsequently, we focus on enhancement strategies, including alloying, doping, structure design, interface engineering, single-atom catalyst design, high-entropy alloy design, phase engineering, and defect engineering, with typical examples illustrating structure-property correlations. Finally, we address remaining challenges and future prospects for the development of efficient and durable Ru-based electrocatalysts for sustainable hydrogen production.

SCIENCE CHINA Materials2026DOI: 10.1007/s40843-025-4009-0

Full-color high brightness Micro-LED displays with high bonding yield realized via photosensitive conductive polymeric bumps

Micro light-emitting diode (Micro-LED) display technology is a promising next-generation display technology due to its high brightness, high contrast, low power consumption, long life, and fast response. However, aggressive downscaling of Micro-LEDs to a few microns makes lift-off fabrication of metal bumps for soldered joints between Micro-LEDs and driver substrates increasingly difficult, challenging high-yield bump arrays under high-density conditions. This study innovatively replaces conventional metal bumps with a photosensitive conductive polymer (PCP), enabling fabrication of polymeric micro-bump arrays via well-established photolithography, bypassing complex lift-off processes and reducing short-circuit risk. Isopropyl alcohol regulates developer wettability for optimal development, yielding bump arrays with bump size 20 μm × 12 μm and height (1.9288 ± 0.0213) μm on thin-film transistor (TFT) drivers with yield over 99.99%. The issue of low bonding yield from polydimethylsiloxane (PDMS) thermal expansion was resolved by adjusting chip spacing on the temporary substrate, achieving bonding yield exceeding 99.8%. A 0.99-inch full-color Micro-LED display with density 114 pixels per inch (PPI) and brightness 5537 cd/m² was fabricated. High-yield bump arrays, Micro-LED arrays, and high bonding yield are highly reproducible, promoting development of Micro-LED displays and related fields.