• • Photosensitive conductive polymer (PCP) bumps achieve bump size 20 μm × 12 μm and height (1.9288 ± 0.0213) μm on TFT drivers with yield over 99.99%, eliminating lift-off process complexity and short-circuit risk.
• • Bonding yield exceeding 99.8% is achieved by compensating PDMS thermal expansion via chip spacing adjustment on temporary substrate, critical for high-density integration.
• • A 0.99-inch full-color Micro-LED display with 114 PPI and peak brightness 5537 cd/m² at 10 μA drive current demonstrates practical viability.
• • Isopropyl alcohol regulation of developer wettability enables optimal development of PCP bumps, ensuring reproducibility and high yield essential for manufacturing.