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Verified CAS / Academic Author2 Decoded Studies

Prof. BAO Wenzhe

Guizhou University; Shenzhen University

Research Publications & English Decoded Briefs

Showing 2 publications
SCIENCE CHINA Materials2026DOI: 10.1007/s40843-026-4466-3

Ultrasonic Vibration-Assisted Mechanical Coating of Cr Powders on 45 Steel for Superior Corrosion Resistance

Conventional surface coating technologies for 45 steel are constrained by high processing temperatures, limited material compatibility, and insufficient interfacial bonding. This study introduces ultrasonic vibration-assisted mechanical coating (UVAMC) as a low-temperature deposition route that mitigates these limitations. The process yields a chromium coating on 45 steel with a nanoscale elemental interdiffusion transition layer at the interface, achieving a bonding strength of 66.0 MPa. The coating delivers improved corrosion resistance in aggressive environments while preserving the substrate's original compressive and tensile strength. The method also demonstrates broad process adaptability, successfully depositing copper, aluminum, and 316 stainless steel powders, and forming complex shapes such as the "SZU" pattern. These results establish UVAMC as a viable surface functionalization strategy for metallic materials, combining efficient deposition with operational flexibility.

SCIENCE CHINA Materials2026DOI: 10.1007/s40843-025-4028-5

Ultrasonic vibration enabled cold manufacturing of high thermal conductive Cu/Diamond composites

The escalating thermal management demands of modern electronics necessitate materials with superior thermal conductivity and matched thermal expansion. Cu/Diamond composites are promising, yet their fabrication typically requires extreme conditions (high temperature/pressure) or complex coating processes. This work introduces a one-step, heat-source-free cold manufacturing method using ultrasonic vibration to consolidate Cu/Diamond composites at room temperature and a low pressure of ~16 MPa within seconds. The applied pressure is reduced by 200–500 times, and the required temperature is only 20% of that used in conventional high-temperature high-pressure sintering. Direct metallurgical bonding at Cu-Cu interfaces and solid embedding of diamond particles in the Cu matrix are achieved, yielding a composite with a high yield strength of 150 MPa. The method enables a maximum diamond proportion of ~60%, resulting in a thermal conductivity exceeding 1043 W/(m·K) and a coefficient of thermal expansion below 10×10⁻⁶ K⁻¹. Complex shapes are readily fabricated, and heat dissipation tests demonstrate superior performance compared to commercial Al₂O₃ and AlN substrates. The loose preparation conditions and rapid processing confer significant industrial production potential.