• • The ultrasonic vibration cold manufacturing process operates at a low pressure of ~16 MPa and room temperature, reducing the applied pressure by 200–500 times and the required temperature to only 20% of that used in conventional high-temperature high-pressure sintering (HTHP), enabling energy-efficient and rapid fabrication within seconds.
• • The resulting Cu/Diamond composite achieves a high yield strength of 150 MPa, attributed to direct metallurgical bonding between Cu particles and solid embedding of diamond, ensuring mechanical integrity for demanding thermal management applications.
• • With a maximum diamond proportion of ~60%, the composite exhibits a thermal conductivity exceeding 1043 W/(m·K) and a coefficient of thermal expansion below 10×10⁻⁶ K⁻¹, meeting the stringent requirements for heat dissipation in high-power electronics.
• • The method's flexibility allows fabrication of composites with complex shapes, and heat dissipation tests show superior thermal management performance compared to commercial Al₂O₃ and AlN, demonstrating its practical applicability and potential for industrial scale-up.