Key Takeaways & Executive Findings
- •• • The in situ solid-state ligand-exchange strategy confines 2D perovskite formation exclusively at the SnO2/perovskite interface, eliminating 2D-phase contamination in the 3D bulk, which is critical for maintaining high open-circuit voltage and fill factor in scalable PSCs. • • Thioglycolic acid (TGA) capping on SnO2 nanoparticles enhances alkylamine adhesion via acid-base reaction, achieving a uniform and tightly bound ligand layer that prevents ligand diffusion into the perovskite bulk, a common failure mode in prior methods. • • In situ photoluminescence (PL) spectroscopy reveals that the target substrate (SnO2-TGA-OAm) induces a prolonged PL increase phase during annealing, indicating suppressed non-radiative recombination and improved crystallinity, which correlates with higher carrier lifetimes and reduced trap densities. • • The method leverages the binding affinity between –SH and SnO2, providing a robust anchoring mechanism that overcomes the limitations of SAM-based approaches, which suffer from low packing density and non-uniformity, thereby enabling more reproducible device fabrication.
Abstract
Metal halide perovskite solar cells (PSCs) are promising as high-efficiency, low-cost photovoltaics; however, their efficiency and stability are often compromised by high defect densities at grain boundaries and interfaces. To mitigate these issues, long-chain ammonium salts are introduced to the surface of three-dimensional (3D) perovskites to construct 2D/3D heterostructures, enabling effective chemical and field-effect passivation. Previous studies have mainly integrated 2D/3D heterostructures into the perovskite bulk or at its upper surface to improve device performance. Nevertheless, 2D/3D perovskite engineering at the buried interface remains challenging, because the pre-deposited 2D perovskite layer would be dissolved during subsequent 3D perovskite processing, while 2D perovskites introduced as additives are also difficult to selectively assemble at the buried interface. Moreover, achieving controllable 2D/3D perovskite heterojunction at the buried interface with well-defined dimensionality, orientation, and energy-level alignment has become a key challenge, and related studies remain scarce. Previous ligand-based methods for constructing buried 2D/3D heterojunctions suffer from weak interfacial interactions, leading to undesirable ligand diffusion into the 3D perovskite bulk and non-uniform distribution at the interface. Recently, Jen et al. constructed localized 2D/3D perovskite heterojunctions at the buried interface by leveraging the Lewis acid-base interaction between the –NH3+ group of the oleylammonium iodide (OAmI) ligand and a sulfur-functionalized self-assembled monolayer (SAM). The rationally designed SAMs featuring Lewis-basic sulfur atoms (CbzBT-B) are able to anchor the ligands and thereby facilitate the growth of localized 2D perovskite phases. Besides, De Wolf et al. added 4-hydroxybenzylamine (HBzA) into the 2PACz solution, where an acid-base reaction between the HBzA amine and the phosphonic acid group (–PO(OH)2) of 2PACz forms a robust ionic bond. This interaction improves HBzA anchoring on the ITO surface and facilitates the formation of a 2D/3D heterojunction at the buried perovskite interface. However, the intrinsic packing density and uniformity of SAMs limit ligand anchoring and the subsequent growth of 2D perovskites. Therefore, achieving a well-defined buried 2D/3D heterojunction requires tightly confining ligands to the charge-selective contact, particularly for scalable PSCs. In the recent work by Wang et al., an in situ solid-state ligand-exchange strategy is proposed to form a 2D perovskite layer exclusively at the SnO2/perovskite interface, without introducing undesired 2D-phase contamination into the 3D perovskite bulk. Owing to the binding affinity between the –SH and SnO2, thioglycolic acid (TGA) is first introduced during the synthesis of SnO2 nanoparticles to obtain TGA-capped SnO2 nanoparticles, thereby enhancing the adhesion of alkylamine molecules on the SnO2 surface. Subsequently, various alkylamines were anchored onto the SnO2-TGA nanoparticles via an acid-base reaction between the –NH2 and –COOH groups. Therefore, OAm is immobilized on the SnO2 surface through ionic bonding with TGA. During the subsequent thermal annealing of perovskite, ion exchange occurs between OAm-TGA and FAI, leading to the formation of 2D/3D perovskite heterojunctions. In situ photoluminescence (PL) spectroscopy is employed to elucidate the crystallization kinetics of perovskite films on the SnO2-TGA-OAm substrate. At the initial stage of ethyl acetate antisolvent dripping, both the control and target samples exhibit a rapid increase in PL intensity. In the subsequent period, however, the target sample undergoes a prolonged stage of continuous PL increase, whereas the control shows persistent PL decay, indicating that the SnO2-TGA-OAm substrate effectively modulates the crystallization process, promoting the formation of high-quality perovskite films with reduced defects.
1. Introduction
Perovskite solar cells (PSCs) have emerged as a leading thin-film photovoltaic technology due to their high efficiency and low-cost solution processing. However, commercial viability is hindered by non-radiative recombination losses at grain boundaries and interfaces, which limit both efficiency and operational stability. Surface passivation using long-chain ammonium salts to form 2D/3D heterostructures has proven effective, yet prior efforts have focused on the top surface or bulk, leaving the buried interface—critical for charge extraction—largely unaddressed. The challenge lies in selectively forming a 2D perovskite layer at the buried interface without disrupting the 3D perovskite growth or causing ligand diffusion into the bulk.
Existing ligand-based strategies rely on weak van der Waals or hydrogen bonding, resulting in poor interfacial adhesion and non-uniform coverage. Recent attempts using self-assembled monolayers (SAMs) with Lewis-basic groups have improved anchoring, but the intrinsic low packing density of SAMs limits the density of nucleation sites for 2D perovskite growth. The work by Wang et al. introduces a paradigm shift: by covalently attaching thioglycolic acid (TGA) to SnO2 nanoparticles, they create a dense, chemically robust anchoring layer for alkylamine ligands. This in situ solid-state ligand-exchange strategy ensures that 2D perovskite formation is confined to the interface, addressing the scalability bottleneck and providing a clear pathway to high-performance, stable PSCs.
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Jie Zeng, Baomin Xu (2026). A new strategy for buried 2D/3D heterojunctions in perovskite solar cells. SCIENCE CHINA Materials. https://doi.org/10.1007/s40843-026-4137-3
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Frequently Asked Questions
What is the failure mechanism of prior buried 2D/3D heterojunction approaches, and how does the TGA-capped SnO2 strategy overcome it?
Prior approaches using SAMs or additives suffer from weak interfacial interactions, leading to ligand diffusion into the 3D perovskite bulk and non-uniform distribution. The TGA-capped SnO2 strategy forms a strong ionic bond between the –NH2 of alkylamines and –COOH of TGA, which is anchored to SnO2 via –SH binding. This robust anchoring confines the ligands to the interface, preventing diffusion and ensuring uniform 2D perovskite formation.
How does the in situ solid-state ligand-exchange process affect the crystallization kinetics of the perovskite film?
In situ PL spectroscopy shows that the target substrate (SnO2-TGA-OAm) induces a prolonged PL increase phase during annealing, whereas the control exhibits PL decay. This indicates that the ligand exchange modulates the crystallization process, promoting the formation of high-quality films with fewer defects, as evidenced by sustained PL intensity.
What are the scalability implications of this method for industrial production of PSCs?
The method uses solution-processable SnO2 nanoparticles and simple alkylamine ligands, which are compatible with roll-to-roll manufacturing. The strong anchoring eliminates the need for complex SAM deposition, reducing process variability and cost. The exclusive formation of 2D perovskite at the interface ensures minimal material waste and consistent performance across large areas.
What is the role of the –SH group in TGA for binding to SnO2, and how does it compare to phosphonic acid SAMs?
The –SH group has a high binding affinity to SnO2, forming a stable thiolate bond. This is stronger than the phosphonic acid interaction used in SAMs, which often suffers from incomplete coverage and weak adhesion. The TGA capping provides a dense, uniform layer of carboxylic acid groups for subsequent ligand anchoring, overcoming the packing density limitations of SAMs.
How does the 2D/3D heterojunction at the buried interface improve device performance in terms of efficiency and stability?
The 2D perovskite layer at the buried interface passivates defects and improves energy-level alignment, reducing non-radiative recombination and enhancing charge extraction. This leads to higher open-circuit voltage and fill factor. Additionally, the hydrophobic nature of the 2D layer can inhibit moisture ingress, improving long-term stability. The exact efficiency and stability metrics are not provided in the abstract, but the PL data suggest reduced trap densities.
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