Surface-Confined Metallization of Nanofibrous Networks via Selective Dissolution-Assisted Transfer Printing for Lightweight and Air-Permeable Soft Electronics
Air-permeable and ultrathin conductive electrodes are essential for next-generation soft electronics, including breathable wearables, on-skin devices, and bio-integrated electronics. However, conventional metallization strategies, such as sputtering and ink-printing, often suffer from severe vertical charge leakage due to the porous and ultrathin characteristics of nanofibrous networks, leading to device short-circuiting, operational failure, and limited vertical integration. Here, we present a solvent-selective dissolution-assisted transfer printing strategy to achieve surface-confined metallization of ultrathin, lightweight, and gas-permeable nanofibrous networks, enabling lateral conductivity while maintaining vertical insulation. This transfer printing process facilitates not only the rapid formation of conductive patterns on the surface of nanofibrous networks but also mechanical reinforcement through solvent evaporation-induced interlocked fiber-fiber welding. Meanwhile, the strategy preserves the high permeability of the nanofibrous networks and imparts a unique combination of surface conductivity (2 Ω cm) and vertical insulativity (10^11 Ω cm). The resulting anisotropic conductive networks enable low-voltage wearable heaters, high-sensitive pressure sensors, and ultralight temperature sensors. A pressure-temperature dual-modal sensing patch is further fabricated for intelligent grasping classification. The proposed surface-confined metallization strategy enables rapid fabrication of an anisotropic conductive network as a building block to construct air-permeable, ultrathin, and lightweight wearable electronics.