Chinese Journal of Environmental Engineering•2026•DOI: 10.12030/j.cjee.202507055
The increasing complexity of pollutant sources in municipal wastewater networks, driven by unauthorized industrial discharges, poses significant risks to the stable operation of wastewater treatment plants. This study, conducted in an industrial park in Ningbo, Zhejiang Province, developed a source apportionment method using excitation-emission matrix (EEM) fluorescence spectroscopy combined with spectral angle mapping (SAM). A pollution fingerprint database was constructed from wastewater samples of six representative enterprises (A–F) and municipal sewer samples. The SAM algorithm demonstrated high sensitivity and stability in detecting changes in water composition, with spectral angle values showing a strong linear correlation (R² > 0.88) with the volume ratio of enterprise wastewater in mixed samples. This enabled both qualitative identification and quantitative estimation of pollution sources. Field application over a 12-hour monitoring period identified two enterprises as major contributors to organic matter and nitrogen during critical pollution episodes, consistent with trends in DOC, TN, and UV254. The proposed EEM+SAM approach offers a non-invasive, high-throughput method for real-time monitoring and source tracing of multi-source pollution in complex sewer systems, providing a scientific basis for pollution accountability and precise enforcement.
SCIENCE CHINA Materials•2026•DOI: 10.1007/s40843-025-4008-2
Lung cancer, particularly non-small cell lung cancer (NSCLC), remains a leading cause of cancer-related mortality, with conventional therapies hampered by poor tumor specificity, low drug accumulation, and suboptimal efficacy. To address these challenges, we rationally designed a tumor-targeted, ferrocene-bearing, covalently immobilizable theranostic probe, dIR-CDF, for near-infrared (NIR) imaging-guided photodynamic-ferroptosis synergistic therapy. The probe exploits the overexpression of sulfenated proteins in the tumor microenvironment to specifically target integrin αvβ3-positive NSCLC cells and undergo covalent anchoring via the reaction between 1,3-cyclohexanedione and sulfenic acid, thereby enhancing tumor accumulation and retention. Under 808 nm irradiation, dIR-CDF generates singlet oxygen (1O2) for photodynamic therapy (PDT), while the sustained release of ferrocene catalyzes Fenton reactions to produce hydroxyl radicals (·OH), inducing ferroptosis. The synergistic action of PDT and ferroptosis amplifies lipid peroxidation and disrupts antioxidant defenses, leading to efficient suppression of NSCLC tumors in living mice. This work presents a universal and powerful theranostic platform for precise cancer diagnosis and treatment, with the covalent targeting strategy offering enhanced specificity and retention.
SCIENCE CHINA Materials•2026•DOI: 10.1007/s40843-025-4274-x
The escalating power density of electronic devices necessitates effective visible-light shielding in advanced packaging to ensure circuit security and long-term reliability. Photosensitive polyimides (PSPI) serve dual roles as photodefinable dielectrics and structural layers, but intrinsically black PSPI (B-PSPI) suffer from competitive ultraviolet (UV) absorption between chromophores and photosensitive moieties, limiting co-optimization of deep visible-light blocking and lithographic resolution. Here, we report a main-/side-chain spatial decoupling strategy to synthesize a novel B-PSPI. By polymerizing pyromellitic dianhydride with a main-chain coloring monomer (4,4'-diaminodiphenylamine) and a side-chain photosensitive monomer (1,4-dihydropyridine-functionalized diamine), the monomer stoichiometric ratio is precisely engineered. This design spatially isolates functional groups and enhances charge transfer, yielding exceptional visible-light shielding (CIE L* index of 21.39, cut-off wavelength ≈ 555 nm) with good lithographic sensitivity. UV exposure triggers in situ generation of coordination sites from photosensitive groups, anchoring active metal species for electroless copper plating. This enables direct additive fabrication of fine copper lines (40/80 μm line width/spacing) with robust Cu/B-PSPI interfacial adhesion of 16.6 MPa. This work provides a robust molecular design paradigm for B-PSPI, integrating superior optical shielding and surface metallization for high-density interconnect applications.