• • EXIM films achieve EMI shielding effectiveness of ~70 dB at ~1 μm thickness and up to 80 dB at 1.9 μm, breaking the thickness-performance trade-off; this enables ultra-thin conformal shielding for next-gen flexible electronics.
• • Shielding performance scales with the number of metal–MXene heterointerfaces, not total thickness; multilayer stacking (e.g., Cu/Ti3C2Tx/Cu) enhances absorption efficiency, allowing design flexibility without adding bulk.
• • Cr–Al dual-metal passivation layer suppresses MXene oxidation, ensuring long-term operational reliability; this is critical for commercial deployment where environmental stability is mandatory.
• • Films are compatible with physical vapor deposition and spray coating, enabling scalable, large-area production; practical demonstrations in USB 3.0 chips and flexible Schottky diodes confirm effectiveness in mitigating Bluetooth interference and blocking electromagnetic noise.