• • Achieved 'double-90' copper foil: tensile strength >900 MPa and electrical conductivity >90% IACS, surpassing the prior 'double-70' benchmark (strength >700 MPa, conductivity >70% IACS) by over 28% in strength and 28% in conductivity, enabling thinner and more efficient electronic components.
• • The gradient super-nano domain (GSD) structure, with semi-coherent interfaces and solute atoms (C, O, Cl), reduces electron scattering, allowing simultaneous high strength and conductivity—a critical departure from conventional nanocrystalline approaches that sacrifice conductivity for strength.
• • Fabricated via electrodeposition under industrial production conditions, the process is scalable for continuous large-scale manufacturing, addressing the cost and efficiency constraints that have hindered adoption of advanced copper alloys.
• • The GSD structure exhibits superior thermal stability, preventing room-temperature self-annealing that plagues conventional nanocrystalline copper foils, ensuring long-term reliability in applications like lithium battery current collectors and chip interconnects.