• • SEAP treatment at 40 °C and 1500 psi increases number-average molecular weight by 16%, enabling enhanced chain entanglement and mechanical robustness, critical for load-bearing bioelectronic implants.
• • Young's modulus reaches a record 51.08 GPa (a 144% increase in elongation at break simultaneously), breaking the stiffness-ductility trade-off; this dual improvement is essential for flexible devices that must withstand repeated deformation without fracture.
• • Optical transmittance improves by 44% and refractive index reaches 1.2, making P34HB suitable for optical communication and display applications where clarity and light management are paramount.
• • Electrical insulation is enhanced: leakage current drops by 50% to below 1 pA and dielectric loss reduces to 0.06, ensuring reliable performance in low-power bioelectronic circuits and reducing signal interference.