• • Achieves bonding strength up to 5.0 MPa on optically transparent glass and polymeric substrates, enabling robust adhesion for high-stress applications while maintaining optical clarity (>90% transmittance).
• • Demonstrates thermally sensitive H-bonding interactions that trigger deadhesion at elevated temperatures, allowing non-destructive detachment and component reuse, reducing repair costs by up to 30% in foldable displays.
• • Exhibits both mechanical and chemical recyclability, addressing end-of-life issues and reducing material waste, aligning with EU Ecodesign for Sustainable Products Regulation (ESPR) directives.
• • Outperforms commercial optical adhesives in comprehensive properties, including adhesion strength and recyclability, offering a scalable and cost-effective solution for next-generation optoelectronics.