Liquid Metal Interconnects Overcome the Fill-factor Limitations of Stretchable Pixelated Electronic Devices

• • Ultrathin single-crystalline silicon pixels of ~700 nm thickness achieve high-performance photodetection, enabling high fill factor without compromising optoelectronic quality. • • Liquid metal interconnects accommodate deformation, maintaining stable photodiode characteristics and repeatable photoresponses under high-curvature hemispherical stretching and large biaxial tensile strain, overcoming the fill-factor limitations of conventional stretchable arrays. • • The platform demonstrates two distinct visual applications: a human-eye-inspired robotic vision system with a curved photosensitive surface for wide-field imaging, and an epidermal, lensless, near-contact imaging device for close-range acquisition, enabling multiscale visual acquisition and depth perception. • • The introduction of multilayer metal–liquid metal hybrid interconnects provides a scalable route for constructing larger and more complex stretchable pixel arrays, addressing the wiring complexity and integration challenges of prior approaches.