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Open AccessDOI: 10.1007/s40843-025-3592-5Original Research

Interface engineering in hexagonal boron nitride/metal systems: from in situ growth to metal matrix composites

Tianjin University

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Interface engineering in hexagonal boron nitride/metal systems: from in situ growth to metal matrix composites
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SCIENCE CHINA Materials
Published:January 15, 2025Edition:Vol. 68, Issue 9 • pp. 100-112Citation:Jian Yang et al. (2025), SCIENCE CHINA Materials
Impact Factor3.5 (Q2 Scopus)
Source Journal中国科学: 材料

Key Takeaways & Executive Findings

  • • • h-BN/Mg composites exhibit interface bonding features that directly influence mechanical properties; dry sliding wear behavior of Mg/BN nanocomposites shows measurable improvements in wear resistance, critical for lightweight automotive and aerospace components where friction and mass reduction are paramount. • • Field-sintered boron nitride nanotube-magnesium alloy composites demonstrate direct observation of strengthening behavior, with interface engineering yielding enhanced load transfer, essential for structural applications requiring high specific strength. • • Cu/h-BN nanocomposites synthesized via powder metallurgy achieve physico-mechanical and tribological property enhancements, with h-BN acting as a solid lubricant; this is industrially relevant for electrical contacts and bearings where friction and wear reduce service life. • • Boron nitride nanosheet/copper nanocomposites via molecular-level mixing show enhanced mechanical properties, and TiN transition interface in BNNS/Cu composites cooperatively enhances mechanical and tribological properties, addressing the bottleneck of weak interfacial bonding in metal matrix composites.
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Abstract

Hexagonal boron nitride (h-BN) possesses a unique combination of high thermal conductivity, superior hardness, outstanding chemical stability, and a wide bandgap (~5.5–6 eV), rendering it indispensable for high-temperature lubrication, thermal management, electronic devices, and superhard tools. The performance of h-BN/metal systems is fundamentally governed by interfacial characteristics, including atomic structure, chemical bonding, electronic band alignment, and defect states. This review systematically analyzes interface engineering in h-BN/metal systems via two primary routes: in situ growth and ex situ compositing. During in situ growth of h-BN thin films on metal substrates (e.g., Cu, Ni), the metal substrate and growth conditions exert multifaceted influences on film quality through interfacial coupling, directly impacting contact resistance, operational stability, and noise characteristics in devices such as field-effect transistors and photodetectors. For ex situ preparation of h-BN/metal composites, interface construction is synergistically determined by h-BN dimension, matrix properties, and fabrication process. Empirical studies on Mg/BN and Cu/BN composites demonstrate that interface engineering, including surface modification and transition layers (e.g., TiN), significantly enhances mechanical and tribological properties. This review elucidates fundamental principles and unique mechanisms of h-BN/metal interface control, providing strategic insights for designing advanced h-BN-based functional devices and composites.

1. Introduction

Commercial deployment of h-BN/metal systems has been impeded by inadequate interfacial control, leading to premature failure in electronic devices and composites. In h-BN-based field-effect transistors and photodetectors, metal contacts often exhibit high contact resistance and instability due to poor h-BN/metal interface quality, limiting on-off ratios and increasing noise. Similarly, in metal matrix composites, the chemically inert nature of h-BN results in weak bonding with metal matrices, causing inefficient load transfer and degraded mechanical performance. Existing approaches, such as simple mechanical mixing or unoptimized growth, fail to address the atomic-level structural and chemical discontinuities that govern charge transfer and mechanical integrity.

This review confronts these bottlenecks by systematically analyzing interface engineering in h-BN/metal systems through two distinct pathways: in situ growth and ex situ compositing. For in situ growth, the metal substrate and growth conditions are shown to dictate h-BN crystallinity, planarity, and topological structure via interfacial coupling. For ex situ composites, interface construction is synergistically determined by h-BN dimension, matrix properties, and fabrication process. By elucidating fundamental principles and unique mechanisms, this work provides strategic insights for designing advanced h-BN-based devices and composites with optimized interfacial properties.

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Cite This Research Paper
Jian Yang, Shaoqiang Zhu, Dongdong Zhao, Xudong Rong, Xiang Zhang, Naiqin Zhao, Chunnian He (2025). Interface engineering in hexagonal boron nitride/metal systems: from in situ growth to metal matrix composites. SCIENCE CHINA Materials. https://doi.org/10.1007/s40843-025-3592-5
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Frequently Asked Questions

What are the primary failure mechanisms at h-BN/metal interfaces under mechanical or thermal stress?

Failure mechanisms include weak van der Waals bonding leading to interfacial debonding, and chemical incompatibility causing void formation. In Mg/BN nanocomposites, dry sliding wear tests reveal that inadequate interfacial bonding results in pull-out of BN reinforcements, accelerating wear rates. For Cu/h-BN composites, without interface engineering, h-BN acts as a stress concentrator, reducing tensile strength. Surface modification and transition layers (e.g., TiN) mitigate these by forming chemical bridges that enhance load transfer and thermal stability.

How does the dimension of h-BN (nanotube vs. nanosheet) affect composite performance?

BN nanotubes (BNNTs) provide high aspect ratio and continuous reinforcement, leading to significant strengthening in Mg alloys, as observed in field-sintered BNNT-Mg composites. BN nanosheets (BNNSs) offer large interfacial area for load transfer but may agglomerate; molecular-level mixing in Cu/BNNS composites achieves uniform dispersion and enhanced mechanical properties. Hybrid BNNT/BNNS reinforcements in AZ91 Mg composites exploit both dimensional advantages, improving microstructure and mechanical properties synergistically.

What are the scalability and cost bottlenecks for industrial production of h-BN/metal composites?

Scalability is hindered by the high cost of high-quality h-BN (especially nanotubes and nanosheets) and the complexity of achieving uniform dispersion. Powder metallurgy routes for Cu/h-BN nanocomposites are scalable but require careful control of sintering parameters to avoid interfacial reactions. In situ growth on metal substrates is limited by substrate size and batch uniformity. Cost parity with conventional composites requires reducing h-BN synthesis costs and optimizing fabrication processes to minimize waste and energy consumption.

How does interface engineering impact tribological properties in h-BN/metal composites?

Interface engineering directly influences tribological performance by controlling the formation of lubricious tribofilms and load-bearing capacity. In Cu/h-BN composites paired with C/C-SiC, h-BN modifies the friction coefficient and wear rate by forming a transfer film. TiN transition interfaces in BNNS/Cu composites enhance both mechanical and tribological properties by improving interfacial bonding and preventing h-BN pull-out. For Mg/BN nanocomposites, dry sliding wear tests show reduced wear volume with optimized interfaces.

What are the key challenges in characterizing h-BN/metal interfaces at the atomic scale?

Challenges include the buried nature of interfaces, electron beam sensitivity of h-BN, and the need for correlative techniques. Advanced methods such as high-resolution transmission electron microscopy (HRTEM) and electron energy loss spectroscopy (EELS) can reveal atomic structure and bonding, but sample preparation is critical. In situ studies during growth or deformation are essential to understand dynamic interfacial processes, yet remain technically demanding.

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