• • Localized heating mode achieves 100% release yield of microchips, whereas global heating results in near-zero yield, demonstrating a decisive improvement in non-contact release reliability.
• • Finite element simulations reveal that localized heating concentrates strain energy at the interface, enabling controlled energy release, while global heating dissipates energy, causing failure.
• • Higher ejection velocity under localized heating may induce chip bouncing on the receiver substrate, affecting transfer accuracy; mitigation strategies include optimizing release gap and laser parameters.
• • The study provides theoretical guidelines for energy pathway design, enabling high-yield, accurate non-contact release in SMP-based transfer printing for flexible electronics.