Heat-Shrinkable Thermoplastic Films Enable Universal Conformal Electronics via Semi-Liquid Metal Circuits

• • The copper-EGaIn composite ink achieves a conductivity of 9.5×10^6 S m^-1, ensuring metal-level electrical performance while maintaining flexibility during heat-shrinkage, critical for reliable circuit operation on curved surfaces. • • The thermoplastic PVC shrink film contracts at ~70 °C (glass transition range 57.0–70.6 °C), generating a compressive strain field that enables wrinkle-free conformal adhesion to irregular surfaces, including anti-adhesion materials like PTFE and wet wood. • • The process completes in approximately 5 seconds, offering a rapid, cost-effective alternative to multi-axis printing systems, which are expensive and complex, thus accelerating industrial adoption. • • Finite element simulation allows precise pre-deformation pattern design, ensuring target circuit layouts on arbitrary 3D surfaces post-shrinkage, reducing trial-and-error and material waste in prototyping.