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Official PDF TranslationSCIENCE CHINA Materials

Flexible 'fiber chip': integrating high-density integrated circuits into an elastic polymer fiber

Authors: Xinge Yu

DOI: 10.1007/s40843-026-4050-2Status: Verified Translated Edition
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Key Findings in This Report

• • Achieves an integration density of 100,000 transistors per centimeter, a 100-fold improvement over surface-limited schemes, enabling complex computation within fiber form factors. • • Demonstrates 99.8% classification accuracy on the Olivetti Research Laboratory database using neural-style computing with organic electrochemical transistors, proving feasibility for on-fiber AI. • • Withstands 100,000 cycles of abrasion and 1-mm bending, ensuring mechanical reliability for wearable applications under repeated deformation. • • Implements digital logic gates (NOR, NAND, XOR, RS latches) and analog circuits (amplifiers, waveform generators), matching early commercial chip capabilities and enabling standalone fiber-based processing.
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