A molecular engineering slippery dressing with minimal adhesion and antibacterial property

• • The dressing achieves minimal adhesion to wounds, reducing clot adhesion and secondary injury during dressing changes, which is critical for burn wound management. • • Copper ions are molecularly engineered into the dressing, providing antibacterial activity through membrane disruption and reactive oxygen species production, as confirmed by single-cell detection. • • The antibacterial mechanism involves membrane depolarization and ATP production blockage, leading to protein aggregation and bacterial death, offering a multi-target approach that may reduce resistance development. • • In vivo studies demonstrate accelerated wound healing with enhanced granulation tissue formation and collagen deposition, supporting clinical translation for burn wound care.