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Prof. LIU Chuan

Key Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), Nanjing Tech University

Research Publications & English Decoded Briefs

Showing 2 publications
SCIENCE CHINA Materials2026DOI: 10.1007/s40843-026-4206-6

Dual-Function Ladder Polysilsesquioxanes for Precise Patterning and 3D Integration of High-Performance Flexible Organic Logic Circuits

Precise patterning of highly ordered organic semiconductor (OSC) thin-film arrays is critical for next-generation electronics. We report a ladder-like polysilsesquioxane (LPSQ) strategy to synthesize two functional analogs with tunable surface energies and robust dielectric properties. These LPSQ dielectrics, functionalized with alkyl or fluoroalkyl side chains, serve dual roles as gate insulators and patterning layers to guide blade-coating of 2,7-dioctyl[1]benzothieno[3,2-b][1]benzothiophene (C8-BTBT). This approach yields highly aligned arrays suitable for three-dimensional integration in flexible electronics. Synergistic combination of dense LPSQ dielectric packing and aligned semiconductor domains leads to excellent organic thin-film transistor (OTFT) performance, achieving approximately four-fold improvement in field-effect mobility compared to conventional silicon oxide dielectrics. Patterned LPSQ dielectrics enable high-resolution C8-BTBT patterning on plastic substrates, supporting 4-inch-scale 3D integration of flexible logic circuits, including inverters (voltage gain >100), NOR gates, and NAND gates. This work provides a scalable route to high-performance, large-area flexible organic circuits.

SCIENCE CHINA Materials2026DOI: 10.1007/s40843-025-3983-4

Electrocaloric Devices for Solid-State Refrigeration: Design Strategies and Applications

Refrigeration is essential for modern society, supporting applications from household appliances and industrial manufacturing to microelectronics and biopharmaceutical cold chains. Conventional refrigeration technologies are constrained by environmental impact and low energy efficiency, emphasizing the importance of developing sustainable alternatives. Solid-state caloric refrigeration, particularly electrocaloric (EC) devices, offers a promising route owing to their high cooling efficiency, rapid electric-field-driven response, and potential for miniaturization. Significant progress has been achieved in various EC device configurations. However, EC devices still face challenges in achieving large temperature spans, high cooling power, and effective integration for specific applications. This review systematically summarizes these developments, focusing on device design and performance enhancement. It elucidates the fundamental and shared design strategies, classifies EC devices into fluid-based heat-transfer type, solid-based heat-transfer type, and thermal-resistance-modulated heat-switch architectures, and analyzes representative device structures, performance metrics, and application scenarios. Finally, energy-recovery strategies and future optimization directions toward more efficient EC systems are discussed. This work provides a comprehensive reference for the design innovation and practical implementation of EC-based solid-state refrigeration technologies.